Figure 4

(a) SEM secondary electron image of tungsten net-pattern grid die with 97 μm pit spacing, 25 μm thickness produced by electro-deposition. (Pacific Grid-Tech); inset image shows macro overview of the SEM image of tungsten net-pattern grid die with 3 mm in diameter. (b) SEM secondary electron image of Hf-based amorphous alloy showing an macro view of the imprinted rectangular shape patterns produced by depression of amorphous alloy with compressive loading; inset image shows macro overall view of patterned Hf-based amorphous alloy. (c) Detail view of the SEM image of rectangular patterns imprinted on amorphous alloy showing clear sharp edge of patterns without shear localization. (d) Detail view of the SEM image of lateral edge of imprinted on amorphous alloy showing clear sharp depth edge of pattern produced by compressive loading; inset image is three dimensional topological profilemeter image of lateral edge of imprinted on amorphous alloy. (e) Profilemeter scanned image of Hf-based amorphous alloy showing an overall view of the imprinted rectangular shape patterns with difference of heights.