Table 2 Variables used in dimensional analysis in the MLTθ system.

From: Printability of alloys for additive manufacturing

Variable

Dimension

Volumetric thermal expansion coefficient, β

θ−1

Temperature gradient, ΔT = TP−TS, where TP and TS refer respectively to peak and surrounding temperature

θ

Deposition layer thickness, h

L

Thermal diffusivity, , where k, ρ and CP are thermal conductivity, density and specific heat, respectively of deposit material

L2T−1

Heat input per unit length, , where η, P and v refer to absorption coefficient, beam power and scanning speed, respectively

MLT−2

Melt pool volume, V

L3

Flexural rigidity of the substrate plate, EI, where E and I refer respectively to elastic modulus and second moment of inertia

ML3T−2

Thermal strain parameter, ε*

M0L0T0θ0