Figure 6
From: Large area and deep sub-wavelength interference lithography employing odd surface plasmon modes
(a) Simulated odd SPP interference distribution in the middle plane of PR for structure with rough films. (b) The hp resolution of the odd SPP interference lithography increases as the PR thickness decreases. (c) Electric field intensity distribution in logarithm scale inside the odd SPP interference structure with mask pitch 140 nm and 20 nm-thick PR. (d) Contrast and uniformity of interference fringes at variant positions in PR layer and insets show the fringe profiles at three positions. The other parameters are the same as Fig. 1.
