Figure 2
From: Temperature and microwave near field imaging by thermo-elastic optical indicator microscopy
Thermal imaging by TEOIM for a PCB circuit.
(a) Optical image of the PCB circuit used in the experiment. (b) Linear birefringence images of the OI placed on the PCB circuit. (c) Calculated heat source distribution image. (d) Temperature image measured by infrared (IR) camera and heat source distribution image measured by TEOIM, where the white rectangle indicates the region of interest (ROI) for the temperature sensitivity calculation. (e,f) Intensity and temperature changes of PCB circuit around ROI as a function of the applied current (e) and time (f). (g) Optical image of the PCB circuit used for the time resolved imaging, where DC current of 1A was applied to the two wires, and the distance between the wires was 0.5 mm. (h) Time resolved heat source distribution images. (i) Intensity profiles of heat source distribution images for various time. Inset shows the ROI for the intensity profiles.
