Our PI/BaTiO3 hybrid composites were prepared by mixing the organosoluble PI derived from one-step polymerization with BaTiO3 in dimethylacetamide, screen printing the pastes to form composite films and drying at 90 °C for 24h. The low-temperature process is a key for the PI-based flexible devices to be integrated with flexible electronics. The reported PI/BaTiO3 dielectric films were prepared by a two-step process, which needed to be further imidized at 300 °C.
- Chia-Yang Lin
- Dong-Hau Kuo
- Guey-Sheng Liou
