Thermally stable and photosensitive polymers have been widely developed in recent years for their applications in the electronic packaging such as buffer coating, passivation layers, and insulation layers for redistribution in microelectronics due to their excellent thermal and reasonable dielectric properties. This review describes the recent progress of TSPSPs in the last decade and focuses on their design concept. After a brief introduction of the basic patterning procedure, various chemistries on the design of TSPSPs are highlighted along with two major patterning methodologies such as positive- and negative-working polymers. Furthermore, new applications of TSPSPs, such as low dielectric materials, high refractive index lenses, resists for ITO patterning, and π-conjugated polymers for organic-field effect transistors, are also introduced.
- Mao-Chun Fu
- Tomoya Higashihara
- Mitsuru Ueda
