We demonstrate a LEGO-like assembly of free-standing film of individually operable components encapsulated in a polymer overcoat layer, leading to the integrated architecture without additional electrical connection. The free-standing components are produced by the peeling-off process. The sticky nature of polymer layer enables the construction of supercapacitor arrays and simple RLC circuits through interlocking the individual components.
- Sangkyu Lee
- Jaehwan Ha
- Ungyu Paik
