Reducing thermal conductivity of thermoelectric materials usually results in a tradeoff of electrical conductivity. Here, the authors demonstrate a strategy, which allows for a decoupling of charge and heat transport by incorporating topological-insulating Bi-Sb alloys at the grain boundaries of Fe2VAl-based Heusler compounds.
- Fabian Garmroudi
- Illia Serhiienko
- Takao Mori
