This Review explores adopting 2D semiconductors to overcome the scaling bottleneck of Si-based electronics. Recent trends and potential approaches for the development of 2D materials as a channel are discussed. Following this, the prerequisites, obstacles and feasible technologies for integrating contacts and gate dielectrics with 2D semiconductor-based channels are examined. The Review also provides an industrial perspective towards facilitating monolithic 3D integration.
- Ki Seok Kim
- Junyoung Kwon
- Jeehwan Kim
