This perspective highlights various representative manufacturing methods of 3D microelectronic devices and their specific features/limitations. It offers an outlook on future developments in the manufacturing of 3D multifunctional microelectronics devices, and provides some perspectives on the remaining challenges as well as possible solutions. Mechanically guided 3D assembly based on compressive buckling is proposed as a versatile platform that can be merged with micromanufacturing technologies and/or other assembly methods to provide access to microelectronic devices with more types of integrated functions and highly increased densities of functional components.
- Xiaogang Guo
- Zhaoguo Xue
- Yihui Zhang