Figure 2
From: Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds
Typical SEM images of the as-formed SiC joints soldered under the ultrasonic action for (a) 0.1 s and (b) 1 s; (c) the corresponding magnification views as marked in (a); (d) MF-XRD patterns of the bond layer in (a).
