Fig. 2: Chip fabrication and characterization. | Light: Science & Applications

Fig. 2: Chip fabrication and characterization.

From: Analog parallel processor for broadband multifunctional integrated system based on silicon photonic platform

Fig. 2

a Photograph of the packaged APP chip. Optical signals enter and leave the chip via the edge-coupled fiber. b Layout of the APP chip. The analog signal is temporally discretized through the MZM. The temporal discrete signal is parallelized into two parallel sub-channels by the DO-MZM, with the aid of tunable TDL. c Normalized measured EO modulation responses of the packaged MZM and DO-MZM. d Measured optical output waveforms with a time delay of 8.66 ps (light blue curve), 18.58 ps (dark blue curve), and 28.99 ps (purple curve). Here the orange curve is the measured reference optical output waveform passing through the corresponding straight waveguide

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