Fig. 3: Fabrication and packaging of the proposed sensor. | Microsystems & Nanoengineering

Fig. 3: Fabrication and packaging of the proposed sensor.

From: A MEMS wall shear stress sensor with floating cover plate for aerospace flow monitoring in harsh environments

Fig. 3

a Simplified schematic of the fabrication process. b The front and c the back view of photographs of the sensor die. d Optical microscope images of the floating cover plate. e Optical microscope images of the floating sensing structures. f SEM image photos of the floating sensing structure. g PCB circuit of the sensor. h Metal casing of the sensor packaging

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