Fig. 4: Critical processes. | Microsystems & Nanoengineering

Fig. 4: Critical processes.

From: A MEMS wall shear stress sensor with floating cover plate for aerospace flow monitoring in harsh environments

Fig. 4

a Lag effect in etching processes. b Resistance measurement between movable and fixed comb fingers. c Effect of corrosion window size on wet corrosion morphology of glass. d Wet corrosion rate of glass in the depth direction. e Wet corrosion rate of glass in the width direction. f Adhesion of comb teeth due to uneven bonding voltage loading. g Key process parameters in the silica glass bonding process

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