Fig. 6: High-temperature oxidation resistance (HTOR) and the invariance of the electrical properties of sioxed Cu with various geometries.
From: An impermeable copper surface monolayer with high-temperature oxidation resistance
a Resistivity measurement of sioxed SCCFs as a function of temperature and comparison with reference materials and non-treated SCCF. Error bars represented the standard deviation of resistivity measurements obtained from five randomly selected samples. The dashed lines represent the reference resistivity values for bulk Au (\({\rho }_{{Au}}\)) and Cu (\({\rho }_{{Cu}}\)), respectively. Upward arrows indicate divergence of the resistance beyond the conductive regime with increasing heating temperature. Source data are provided as a Source Data file. b HTOR of sioxed Cu foils. c HTOR of a sioxed polycrystalline Cu film deposited and patterned on a polymer substrate for flexible devices. Note that the temperature of 150 °C is the maximum tolerable value for the polymer substrate. d Pictures of Fe foil (upper row) and sioxed Fe foil (bottom row) before and after heat treatment at 300 °C for 30 min. e Pictures of Ni foil (upper row) and sioxed Ni foil (bottom row) before and after heat treatment at 400 °C for 30 min. Scale bars are 5 mm. To ensure statistical validity, each experimental condition was conducted with a minimum of ten samples at each designated temperature. A visual assessment of the samples indicated a consistency in coloration across all replicates.
