Fig. 5: Pick-and-place operation using a robotic arm equipped with the nanotipped SMP surface.
From: Shape memory polymer surfaces with controllable roughness for multiscale switchable dry adhesion
a A Peltier module, used to heat and cool the nanotipped SMP surface, is mounted on the end effector of the robotic arm. b An H-bridge circuit is employed to control the heating and cooling functions of the Peltier module. (i) Cooling mode. (ii) Heating mode. c The pick-and-place process using the robotic arm consists of: (i) picking up the object, (ii) placing the object at the desired location. d SEM images of the nanotipped SMP surface on the Peltier module demonstrate the adhesion switchability during the pick-and-place of a paper. e The manipulation of various objects using the robotic arm with the nanotipped SMP surface includes: (i) glass slide, (ii) stainless sheet, (iii) wood board, (iv) A4 paper, (v) glass vial, (vi) plastic spoon, (vii) egg, (viii) integrated circuit.
