Fig. 1: Electrical conductivities and microstructural characterizations of the as-cast Cu-0.2Be-1.0Ni-0.2Co (in wt.%) alloy solidified under the electromagnetic induction (EMI) and electromagnetic levitation (EML) conditions.
From: Overcoming the trade-off between conductivity and strength in copper alloys through undercooling
a The electrical conductivity variation of the EML samples with undercooling. The standard deviations of the measured electrical conductivities are less than 0.5% IACS. The gray-dashed line denotes the electrical conductivity of the EMI sample. b The HAADF-STEM image of the as-cast EMI-10 sample. c The HAADF-STEM image of the as-cast EML-200 sample. Lots of spherical spots can be observed (orange arrows). d The enlarged atomic image of the blue box area in (c). The insets are the corresponding FFT patterns within and outside the spherical spot. e, f The reconstructed APT atomic maps of the as-cast EMI-10 and EML-200 samples obtained by APT detection. Source data are provided as a Source Data file.
