Fig. 2: The printing behavior on the Al2O3 substrate and sacrificial coating (SC)-Al2O3 substrate. | Nature Communications

Fig. 2: The printing behavior on the Al2O3 substrate and sacrificial coating (SC)-Al2O3 substrate.

From: Directly printed standing ceramic circuit boards for rapid prototyping of miniaturization and high-power of electronics

Fig. 2

a The surface morphology of the Al2O3 and SC-Al2O3 substrates. b Surface roughness of Al2O3 in an area of 10 × 10 μm. c Surface roughness of the SC-Al2O3 substrate in an area of 10 × 10 μm. d Comparison between the surface morphology of the SC-Al2O3 substrate and that of the Al2O3 substrate. e Standard deviation of the line width printed on both the SC-Al2O3 and Al2O3 substrates. f Shrinkage of the line width after sintering on both the SC-Al2O3 and Al2O3 substrates. g The AR of the Ag wire vs. the number of printed layers on both the SC-Al2O3 and Al2O3 substrates. The inset picture is a enlarged view of the values on the SC-Al2O3. h The line width of the Ag wire vs. the number of printed layers on both the SC-Al2O3 and Al2O3 substrates. i The printed silver wires on the Al2O3 substrate (10.2 μm). j The sintered silver wires on the Al2O3 substrate (8.6 μm). k The sintered 6 layers of the silver wires on the Al2O3 substrate with a line width of 44 μm. l The contour lines of the multi-layer silver wires on Al2O3 substrate. m The printed silver wires on the SC-Al2O3 substrate (10.6 μm). n The sintered silver wires on the SC-Al2O3 substrate (7 μm). o The sintered 6 layers of silver wires on the SC-Al2O3 substrate with a line width of 10 μm and an AR of 1.7. p The contour lines of the multi-layer silver wires on SC-Al2O3 substrate. Data are presented as the mean values ± SD, n = 3 independent samples (e–h). Source data are provided as a Source Data file.

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