Fig. 2: Analysis of stencil and metal patch resolution.
From: Precise surface patches on active particles of arbitrary shape through microstenciling
a Resolution was tested by depositing 10 nm chromium and 30 nm gold via electron beam deposition through a stencil directly onto the borosilicate substrate after which the stencil was removed. Stencil design contains lines and circles of decreasing width and a gradually tapering triangle. Polymer resin is green, metal is black. b Diagram of resolution stencil with labeled dimensions for line width, circle radius and gradually tapering triangle. Boxes highlight lines analyzed in (e, f, h, i). c SEM images (taken in backscattering mode) comparing deposited metal through stencils fabricated at four different laser powers (LPs), 20, 22.5, 25 and 27.5 mW. d–i Measured values of stencil (d–f) and resulting metallic patch (g–i) line widths at different LPs. d, g Plots with measurements for all line widths. Boxes show line widths that were examined further in (e, f, h, i). e, f, h, i Plots comparing line widths 1.5 and 2.5 across laser powers. All error bars represent standard error of the mean. Statistics were calculated with a one-way ANOVA followed by multiple comparison results *P < 0.05, **P < 0.01 (N = 6 except for stencil LP 25 mW, 0.1 µm line where N = 3; patch LP 25 mW where N = 9 (1 µm line N = 3)). Source data are provided in the Source Data file.
