Fig. 3: Mechanical robustness of the transparent, ultrathin Au film. | npj Flexible Electronics

Fig. 3: Mechanical robustness of the transparent, ultrathin Au film.

From: Hexagonal metal complex based mechanically robust transparent ultrathin gold µECoG for electro-optical neural interfaces

Fig. 3

a stress-strain curve from the tensile test with (EDTA/PSS)/PEN film. b Electrical resistance changes during the strain test on the various films. c Calculated stress and strain applied to the substrate according to the various radius of curvature of 8 nm Au/(EDTA/PSS)/PEN film. d Maximum tensile stress of 8 nm Au/(EDTA/PSS)/PEN film. e Resistance change during tensile stress on the film with various bending radii for 8 nm Au/(EDTA/PSS)/PEN film. f Resistance changes during various bending cycles. g–i SEM images of each metal film before/after 50,000 times of bending.

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