Fig. 7: Application utilizing interconnect multi-layered E-textile. | npj Flexible Electronics

Fig. 7: Application utilizing interconnect multi-layered E-textile.

From: Fabrication of multifunctional wearable interconnect E-textile platform using direct ink writing (DIW) 3D printing

Fig. 7

a Fabrication scheme of the interconnect multi-layered E-textile. Layered structure: top layer – strain sensor, middle layer – electrode, bottom layer – pressure sensor. The top and middle layers were textile substrates stretchable only along the x-axis, while the bottom layer, on which the pressure sensor was printed, was a non-elastic textile substrate. b Motion recognition using the interconnect multi-layered E-textile platform: hand clenching and releasing, finger pressing and releasing, and object grasping.

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