Fig. 3: Electronics and substrate compatibilities of soap bubble transfer printing.
From: A versatile transfer printing technique through soap bubble
a The soap bubble stamp hosts rigid (yellow, PI, 50 μm) and flexible (pink, PDMS, 30 μm) electronics with an aspect ratio of 20:1, in both partial and conformal contact manners, respectively. b Successful transferring of both rigid and flexible electronics with the hexagram pattern using the soap bubble stamp. c Three-dimensional curved electronics, including trapezoidal (left) and buckled island-bridge (right) structures, are retrieved from the donor substrate in a damage-free manner. d Lifting of a porous sponge using the soap bubble stamp. e Flexible electronics with patterns can be conformably printed onto concave (top left), convex (bottom left), and sharp-edged (right) surfaces. f Printing of both rigid (right) and flexible (left) electronics onto a porous sponge, which has no resistance to deformation. g Printing of both rigid and flexible electronics onto low-adhesion surfaces, including a circuit board surface with low contact area (left, diameter: 300 μm, spacing: 1 mm) and a polytetrafluoroethylene plate surface (middle) with low surface energy (right, contact angle: 110.7°).
