Table 2 The comparison between the flexible encapsulation used in this manuscript and other encapsulation methods is as follows

From: Innovative stress-release method for low-stress flexible Al2O3 encapsulation films in OLED applications

Structure

WVTR (before)

Bending Radius

Bending Cycles

WVTR (after)

Ref.

Al2O3 50 nm

9.0 × 10−4

13 mm

1000

2.1 × 10−3

20

ZnO/Al2O3-Organic layer

7.87 × 10−6

10 mm

1000

7.78 × 10−5

49

Al2O3-Plasma Polymer

8.5 × 10−5

10 mm

1000

1.1 × 10−4

50

Al2O3-S-H nanocomposite

4.4 × 10−5

10 mm

1000

8.2 × 10−5

51

Pre-bending- Al2O3

1.1 × 10−4

3 mm

5000

3.77 × 10−4

1

ZnO/Al2O3/MgO-S-H nanocomposite

2.44 × 10−6

10 mm

N/A

4.62 × 10−6

52

Al2O3-IJP- Al2O3

5.0 × 10−5

3.2 mm

10

2.031 × 10−4

53

Al2O3/Ag/ Al2O3-S-H nanocomposite

8.7 × 10−6

30 mm

1000

4.46 × 10−5

54

SAM/Al2O3/Ag/PEN

2.62 × 10−4

7 mm

1000

7.65 × 10−4

23

Alucone

3.78 × 10−3

3 mm

10,000

3.84 × 103

Preliminary work of the research team

Al2O3 50 nm

1.1 × 10−4

5 mm

1000

1.15 × 10−3

Preliminary work of the research team

AlCO

1.44 × 10−5

3 mm

10,000

1.50 × 10−5

11

This work (50 °C)

1.05 × 10−5

2 mm

10,000

1.13 × 10−5