Extended Data Table 2 Comparison of previous microcavity array trimming techniques to our parallel laser assisted thermal oxidation (bold). Estimated values are marked with a *. Δλp-p = peak-to-peak wavelength error; Q = mean quality factor

From: A full degree-of-freedom spatiotemporal light modulator

Technique [Year]

Cavity Type

N

\(\Delta{\lambda }_{0}^{{\rm{p}}-{\rm{p}}}\) [pm]

Q

In situ?

Parallel?

‘Holographic’ oxidation [2022]

Si PhC

64

13

2 × 105

Y

Y

Germanium implantation [2021]

Si ring 109

58

32

4 × 103

Y

N

Laser-annealed cladding [2020]

Si ring 110

2

20*

2 × 104

Y

N

Boron implantation [2019]

Si ring 111

4

15

5 × 103

Y

N

Electron-beam irradiation [2018]

Si PhC 112

4

400

3 × 105

N

N

Photo-electro-chemical etching [2017]

GaAs disk 113

5

200*

2 × 104

Y

N

Annealed cladding [2016]

Si ring 114

5

90*

3 × 103

Y

N

Ultraviolet irradiation [2014]

a-Si ring 115

4

45

8 × 103

Y

N

Post-fabrication etching [2013]

GaAs PhC 116

18

100*

3 × 104

N

Y

Photochromatic thin-film [2011]

GaAs PhC 117

3

340

8 × 103

Y

N

Anodic oxidation [2006]

GaAs PhC 118

2

100*

5 × 103

N

N