Extended Data Fig. 1: Device capacitances.
From: Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links
a, Schematic of the transmitter and receiver capacitance sources; 1: electronic driver circuit, 2: electronic chip pads, 3: bump parasitics, 4: micro-disk PN junction, 5: photodiode PIN junction, 6: photonic chip pads. b, Measured imaginary impedances of devices and their fitted capacitor impedances. c, Measured micro-disk junction capacitance as a function of reverse bias voltage.
