Fig. 11

DSC curve (a) and stress-strain curve (b) under different processing parameters for PEEK, (c) Tensile fracture specimen of PEEK and its image presented in the 3D-DIC system.
DSC curve (a) and stress-strain curve (b) under different processing parameters for PEEK, (c) Tensile fracture specimen of PEEK and its image presented in the 3D-DIC system.