Fig. 20
From: Comparative analysis of printed electronics technologies in RF and microwave circuits
Cross-sectional height profile for different printing technologies, (a) DW, (b) SP, and (c) AJP.
Fig. 20 | Scientific Reports
From: Comparative analysis of printed electronics technologies in RF and microwave circuits
Cross-sectional height profile for different printing technologies, (a) DW, (b) SP, and (c) AJP.
