Table 1 Integration challenges of sequential and monolithic CFET

From: Enabling the Angstrom Era: 2D material-based multi-bridge-channel complementary field effect transistors

Integration scheme

Sequential CFET

Monolithic CFET

Process cost

High

Low

Thermal budget

Limited

Limited

Bonding defect

Many

Few

Alignment

Misalign

Precise align

P/N isolation

Wide

Narrow

Design flexibility

Unlimited

Limited

Multi Vth

Straightforward

Complicated

Aspect ratio

Low

High

Electrical isolation

Good

Poor

MOL RC

Small

Large

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