Table 1 Summary of recent progress in metal-polymer hybrid fabrication using various manufacturing methodologies

From: Advances and perspectives in multi-material additive manufacturing of heterogenous metal-polymer components

Publication Year	Reference	Polymer type	Metal type	Fabrication Method	Performance Metrics	Technological Trends
2025	Wang et at.¹⁰³	Polyimide	Cu	SLA & ELP	Good electrical conductivity; improved interfacial adhesion	High-resolution metallization on heat-resistant polymer
2025	Mohammadi et al.¹⁰⁹	PLA	Al	FDM & Lamination	Enhanced stiffness with laminated Al insert	Polymer–metal bonding for lightweight structures
2024	Khan et al.¹¹⁰	PETG	Sn, Ag, Cu	FFF	Printed circuitry; metal path continuity	Iterative printing of multi-layer electronics
2023	Tang et al.⁵⁸	PEGDA	Cu	EF-HMP & Electroplating	Copper layer: 45–50 µm; uniform coating; enhanced adhesion	Room-temperature single-step printing with field-assisted deposition
2023	Credi et al.¹¹¹	BISEMA	Ni	SLA & ELP	Surface resistivity ~0.1 Ω/sq	Self-activating polymer composite for selective metallization
2023	Nouri et al.¹¹²	PETG	Ti, Cu, Ni, Zn	SLM & EPD	Antipathogenic surface properties; metallurgical bonding	SLM-enabled multifunctional surfaces
2022	Xiao et al.¹¹³	PEGDA	Cu, Ni	DLP & ELP	Strong bonding via dopamine-functionalized resin	Functionalized polymers for direct metal deposition
2022	Ryspayev et al.¹¹⁴	ABS	Ag	DLP & ELP	Cu layer 10.6–11.4 µm; conductivity 0.74 × 10⁷S/m	Multi-material DLP for site-specific copper plating
2022	Azar et al.¹¹⁵	Polyester	Cu, Ag	DIW & ELP	Textile integration; decorative/functional layers	Inkjet-based nanoparticle seeding for textiles
2020	Hensleigh et al.¹⁰⁸	ABS	Cu, Ni-P	PμSL & ELP	Solenoids with resistance reduced from 3 kΩ to 18.7 mΩ; inductance 191 nH	Charge-programmed deposition for 3D electronics
2020	Zhan et al.⁹³	ABS	Ni, Pd	FFF & ELP	Flexible 3D structures with plated metal	Catalyst-loaded filament for hybrid 3D printing
2019	Matsuzaki et al.³⁷	PLA	Cu	FFF & Electroforming	Enhanced conductivity after plating	Multi-material printing with integrated metal layer
2019	Sadeqi et al.¹¹⁶	ABS	Au, Ag	SLA & Electroplating	Functional metamaterials	Embedded optics and electronics in SLA-fabricated parts
2019	Vaněčková et al.¹¹⁷	PLA	Cu	FDM & Electroplating	Good surface coverage after plating	Electrochemical activation of FDM parts
2019	Bernasconi et al.¹¹⁸	Urethane-acrylate	Cu, CoNip	SLA & Electrodeposition	Magnetic navigation; multifunctional microdevices	Stimuli-responsive micro-systems
2018	James and Contractor¹¹⁹	ABS/PLA	Cu/Graphite	FDM & Electroplating	Flexible solar cell electrodes	Fractal design for solar energy harvesting
2018	Angel et al. ³²	PLA	Cu, Ni	FFF & Electroplating	Printed inductors with reduced resistance	Selective metallization of conductive regions
2018	Li et al.³⁸	Polythiophene	Ni, Cu	Electroplating	Enhanced adhesion via surface-coated composites	Polymer surface coating with Ni nanoparticles
2017	Bahr et al.¹²⁰	ABS	Cu	SLA & ELP	Intricate 3D antennas with electroplated layers	Voronoi-based structural antennas
2016	Felco et al.¹²¹	PEDOT: PSS	Ag	FDM & Spray-deposition	Planar functional coatings	Printed organic electronics
2006	Ansari et al.¹²²	PMMA	Ni	PBW & Electroplating	Nanoimprint lithography stamps with plated Ni	High-resolution mold fabrication for nanofabrication

SLA Stereolithography, FDM Fused Deposition Modeling, FFF Fused Filament Fabrication, EF-HMP Electrical Field-assisted Heterogeneous Material Printing, ELP Electroless Plating, SLM Selective Laser Melting, EPD Electrophoretic Deposition, DIW Direct Ink Writing, PμSL Projection Micro-Stereolithography, PBW Proton Beam Writing.

Back to article page

Table 1 Summary of recent progress in metal-polymer hybrid fabrication using various manufacturing methodologies

Search

Quick links