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A bendable AI chip for wearable technology
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Nature 649, 1114-1115 (2026)
doi: https://doi.org/10.1038/d41586-026-00037-6
References
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Çeliker, H., Dehaene, W. & Myny, K. Nature 629, 335–340 (2024).
Verma, N. et al. IEEE Solid-State-Circuits Mag. 11, 43–55 (2019).
Geng, D. et al. Nature Electron. 6, 963–972 (2023).
Competing Interests
The authors declare no competing interests.
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