Abstract
A novel epoxy molding compound for electronic industry application was used to conduct thermal analysis characterization using differential scanning calorimetry (DSC) and thermogravimetric analyzer (TGA). The reaction kinetics of cure and thermal degradation have been analyzed based on a proposed iso-conversional model. The kinetic results showed that the cure and decomposition process are complex, and the values of activation energy are dependent on the degree of conversion.
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Lu, M., Choi, HK., Lee, HK. et al. Thermal Reaction Characterization of an Epoxy Molding Compound. Polym J 33, 49–53 (2001). https://doi.org/10.1295/polymj.33.49
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DOI: https://doi.org/10.1295/polymj.33.49
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