Fig. 4 | Heritage Science

Fig. 4

From: Transmission and innovation on gold granulation: the application of tin for soldering techniques in ancient China

Fig. 4The alternative text for this image may have been generated using AI.

SEM images of sample 1. a The arrangement of granules along the meandered grooves on substrate; b the arrangements of granules along the edge; c the granules bearing cutting marks; d the granules bearing cutting marks; e the smooth surface of the granules along the edge; f the joint between granules

Back to article page