Fig. 12: The basic mechanism of TP operation with shape-conformal stamp and the schematic of Si pellets on PDMS stamp.
From: Advancements in transfer printing techniques and their applications in photonic integrated circuits

a TP process with expandable-microsphere-embedded stamp60. Reproduced with permission. Copyright 2020, the American Association for the Advancement of Science. b Thin Si pellet (400 μm × 400 μm × 200 nm) arrays on PDMS stamp60. Reproduced with permission. Copyright 2020, the American Association for the Advancement of Science