Fig. 8: Laser-driven TP process using SMP stamp with carbon-black particles45.
From: Advancements in transfer printing techniques and their applications in photonic integrated circuits
a Inks fabrication on donor substrate. b Heat and compress stamps to bond with inks. c Ink pickup. d Ink alignment. e Release ink from stamp with laser. f Raster laser to release desired pattern. g Contact inks with receiving substrate. h Print desired patterns onto receiving substrate. Reproduced with permission. Copyright 2016, John Wiley and Sons
