Table 1 Summary and comparison of different TP methods

From: Advancements in transfer printing techniques and their applications in photonic integrated circuits

Approach

Stamp material

Regulated parameter

Adhesion switching ratio

Application

Ref.

Kinetically controlled TP

Elastomeric polymer

Peel-off velocity

~3

Au thin film

Si/GaAs

micro-structure

20,21,22

Elastomeric polymer

Bending radius

/

Microscale

Si plate

23

Surface chemical reaction- or additional layer-assisted TP

Elastomeric polymer

Amount of chemical bonds and glue-layer category

/

GaAs/InP micro/nano wire arrays

24

Thermal release tape

Temperature

Infinite

Soft neutral electrode arrays

25,26,27

Solvent release tape

Solvent category

>200

Si plate arrays

Si photodetector arrays

EMG sensor

28

Photo-sensitive tape

UV-light intensity and exposure time

117.5

Au film

GaN arrays

micro-LED arrays

29

PNIPAAm

Temperature

/

2D gold nanoparticle arrays

30,31

Polyvinyl-alcohol stamp

van der Waals force

>106

Cu Au Ag

Pt Ti Ni

32

Sugar mixture stamp

Amount of solvent and temperature

Infinite

Long and thin metal strips

Au disks

33,34

Thermal release tape with water serving as an adhesive layer

Category of certain metal or metal diodes

/

Nano-wire resistor

35,36

Ice

Temperature

/

2D planar or continuous material

37

Elastomeric polymer

Category of soluble interlayer or low surface-energy metal film

/

Micro liquid metal electrode

Au nanowire arrays

capacitor and LED circuit

38,39,40,41,42

Laser-driven non-contact TP

Elastomeric polymer

Laser intensity and exposure time

Infinite

Si chip

Si platelet

micro-LED

43,44

SMP embedded with carbon black particles

UV exposure

Infinite

Si

gold-coated Si

45,46,47

Stamp with cavity filled with air and encapsulated by thin film

UV exposure

Infinite

Si platelet

micro-LED arrays

48

Bio-inspired TP

Gecko-inspired stamp

Lateral or vertical shear force

~204

Si thin membrane

Si platelet

49,50,51,52,53,54,55

Aphid-inspired TP

Contact area

>1000

Si plate

Si thin membrane

56,57,58,59,60,61

Octopus-inspired stamp

Cavity pressure

~293

InGaAs nano-film/nano-ribbon

Si micro-ribbon

Si wafer

PI thin film

62,63,64,65,66,67,68

Other TPs

Liquid drop stamp

Liquid volume

<25

Inorganic flexible thin film micro-LED

69,73

Balloon stamp

External pressure

/

Si platelet

Si-based solar cells

Si-based photodetector

70

Wrap-like stamp

External pressure

/

Light-emitting arrays

solar cells

71,72