Table 2 Comparison of different integration methods
From: Advancements in transfer printing techniques and their applications in photonic integrated circuits
Technology | Thermal budget | Alignment accuracy | Efficiency of III–V materials | Cost | Scalability | Throughput |
|---|---|---|---|---|---|---|
Wafer bonding | High | High | Medium | Medium | High | High |
TP | Low | Medium | High | Low | High | High |
Flip-chip | Medium | Medium | Medium | High | Medium | Low |
Epitaxial growth | Very high | High | Very high | Medium | Low | High |
