Fig. 1: Trans-scale multi-dimensional fiber-chip data transmission and processing. | Light: Science & Applications

Fig. 1: Trans-scale multi-dimensional fiber-chip data transmission and processing.

From: Harnessing diverse hybrid integration for bridging trans-scale multi-dimensional fiber-chip data transmission and processing

Fig. 1: Trans-scale multi-dimensional fiber-chip data transmission and processing.

a Artistic vision of high-capacity trans-scale bridging between long-distance fiber-optic data transmission and ultra-short-reach chip-scale data transmission. b Schematic of “Digital Divide” capacity gap between high-capacity data transmission in fiber links and low-speed data processing at network nodes. c Multi-dimensional fiber-chip data transmission and processing uses the FMF, 3D silica fs-laser direct writing photonic chip, and 2D silicon photonic integrated circuit (PIC) to realize 192-channel and 20-Tbit/s multi-dimensional (mode, polarization, wavelength) data transmission and processing. MDM mode-division multiplexing; PDM polarization-division multiplexing; WDM wavelength-division multiplexing; AMF advanced modulation format; FMF few-mode fiber; TE transverse electric; TM transverse magnetic

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