Fig. 3: TEM observations of the SLM Ag-Cu-Ge alloy after tensile deformation.
From: Premature failure of an additively manufactured material
a–c Bright-field (BF) TEM micrographs showing the interaction of Cu-rich precipitates with dislocations, stacking faults (SFs) and twins43,44,45,46,47,48,49. d BF TEM and e dark-field (DF) TEM images showing the interaction of the grain boundaries with dislocations, SFs and twins. f HR-TEM micrographs showing the interaction of dislocations, SFs and twins with the interface between the Ag-matrix and Cu-rich precipitates; periodic misfit dislocations are clearly seen. g HR-TEM micrographs showing twins in the Cu-rich precipitates. h-i HR-TEM micrographs showing SFs and twins in the Ag matrix. Note that the red arrows indicate dislocation tangles, the yellow arrows indicate twins/SFs, and the white arrows indicate twinned precipitates.
