Fig. 3 | npj Flexible Electronics

Fig. 3

From: Room-temperature processing of silver submicron fiber mesh for flexible electronics

Fig. 3

Photoelectric and toughness studies of silver fiber mesh. a Diagrammatic representation of transparency of different silver fiber mesh as a function of the sheet resistance depicted 550 nm. b Transfer of silver submicron fiber mesh onto a PET substrate to test their stability corresponding different bending radii (10 mm, 9 mm, 7 mm, 5 mm, 2 mm, 1 mm). c Plot between times of bending silver fiber mesh versus the corresponding sheet resistance. (The bending radius is at 7 mm). d Change in resistance as a function of uniaxial strain for silver fiber mesh and the copper film (the silver mesh is attached to PDMS substrate of 4 mm thickness). e SEM image of the curved fiber mesh and the TEM image of a folded fiber (scale bar: 100 μm, 20 μm, 500 nm). f Stability test of sheet resistance for the silver fiber mesh after being repeatedly fixed with an adhesive tape

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