Fig. 1: Photonic lift-off of a polymer substrate containing thin-film devices from a glass carrier. | npj Flexible Electronics

Fig. 1: Photonic lift-off of a polymer substrate containing thin-film devices from a glass carrier.

From: Large-area photonic lift-off process for flexible thin-film transistors

Fig. 1

a Typical material stack for the photonic lift-off (PLO) process, showing illumination through the glass to the light absorber layer (LAL). b Simulated thermal response during PLO at the polymer/LAL interface and on the surface of the polyimide where the device layer would reside. c Flexible TFT array on polyimide lifted off using PLO. Scale bar: 10 mm.

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