Table 1 Material parameters used to create a 3D model of the thermal response during photonic lift-off.
From: Large-area photonic lift-off process for flexible thin-film transistors
Material | Density (g cm−3) | Heat capacity (J kg−1 C−1) | Thermal conductivity (Wm−1 K−1) |
|---|---|---|---|
TiW | 19.25 | 134 | 160 |
Eagle XG | 3.28 | 1100 | 1.2 |
Polyimide (PI 2611) | 1.4 | 1009 | 0.12 |
