Fig. 2: Mechanical and thermal properties of TPS.
From: Soft, stretchable thermal protective substrates for wearable electronics
a The elastic modulus of TPS and b the maximum tensile strain of TPS versus the mass ratio of heat-absorbing microspheres under different temperatures. c The density of TPS versus the mass ratio of heat-absorbing microspheres. d The thermal conductivity of TPS versus the mass ratio of heat-absorbing microspheres before the phase change (25 oC) and after the phase change (50 oC). e The variation of the specific heat capacity of TPS with temperature under different mass ratios of heat-absorbing microspheres. f The latent heat of TPS versus the mass ratio of heat-absorbing microspheres.
