Fig. 4: Wireless tactile acquisition and rendering system for telehaptic communication.

a Image of wireless tactile acquisition module. It illustrates the integrated circuit components of the UFB sensor array: (i) boost/inverting converter, (ii) BLE module, (iii) Microcontroller, (iv) 4 ch D-sensor array, and (v) 32 ch S-sensor array. b System block diagram of tactile acquisition from the UFB sensor array. c Image of wireless tactile rendering circuit board: (vi) Buck converter, (vii) Microcontroller, (viii) BLE, and (ix) 32 ch actuator drivers. d System block diagram of tactile rendering from a tactile actuator array. e Image of the UFB tactile sensor (left) applying tactile stimuli patterns with a vibrator. The sub-mm actuator array (right) measures the vibration amplitude and the acceleration using a LSV, scale bar is 5 mm. f Wireless transmission of tactile stimuli. The sensor output (red) and actuator velocity (blue) was measured while 50 Hz was applied to the sensor using a vibrator. g The delay time between sensor output (red) and actuator output (blue). Sensor signal was wirelessly transmitted, and the vibration was measured by LSV. h the tactile signals (blue) recorded by UFB tactile sensor, while tactile stimuli were applied by the vibrator. i Vibrational displacement (red) of the actuator rendered by transmitted sensor signals. j Correlation matrix correlogram of signal patterns describing the correlation coefficient between the signals acquired by the sensor (S1, S2) and the rendered actuator signals (A1, A2). The S1(e), S2(e) and A1(e), A2(e) were envelope of sensor and actuator signals, respectively.