Fig. 1: Rigid substrates morphological characterization after the lithographic process. | npj Flexible Electronics

Fig. 1: Rigid substrates morphological characterization after the lithographic process.

From: Cu(In,Ga)Se2 based ultrathin solar cells the pathway from lab rigid to large scale flexible technology

Fig. 1

Top-view SEM images of: (a) NIL-SLG and (b) EBL-SLG substrates. The SEM images were taken with a Horizon field width (HFW) of 5 µm and an acceleration voltage of 5 kV. AFM cross-section profiles of a representative point contact of: (c) NIL-SLG and (d) EBL-SLG substrates obtained with a scan rate of 0.5 Hz. We note that the AFM obtained distance for both substrates is within average values for the SEM measurements.

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