Fig. 3: Hybrid sintering of Zn and durability of the traces on transient substrates.
From: Zinc hybrid sintering for printed transient sensors and wireless electronics
a Electrical conductivity (with standard deviations) for sintered Zn traces as a function of energy and number of photonic pulses, on PVA and PLA. b Evolution of the resistance for unencapsulated Zn samples (n = 14 per condition, 40 × 0.3 mm) stored at ambient conditions, as a function of the sintering protocol. c Change in resistance for sintered Zn lines on PLA (n = 5 per condition, 50 × 0.5 mm, with a ~40 µm thickness), for radii of 5 mm and 10 mm, with and without PLA encapsulation. d Evolution of the resistance for encapsulated and unencapsulated sintered Zn tracks (n = 8 per condition, 40 × 0.3 mm) in PBS at 37 °C.
