Fig. 4: Transient resistive physical sensors fabricated from printed Zn encapsulated in PLA (R0 = 89.6 ± 56.4 Ω, n = 4). | npj Flexible Electronics

Fig. 4: Transient resistive physical sensors fabricated from printed Zn encapsulated in PLA (R0 = 89.6 ± 56.4 Ω, n = 4).

From: Zinc hybrid sintering for printed transient sensors and wireless electronics

Fig. 4

a Zn strain sensor submitted to compressive and tensile cycles (insets). b Zn temperature sensor in a vial of PBS, with a reference temperature sensor. Scale bars are 10 mm. c Zn resistance change (blue) following an increasing temperature in PBS (orange). d Zn resistance change (blue) with an arbitrary change in PBS temperature (orange) around physiological temperatures.

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