Fig. 2: Schematic illustration and simulation of hole-opening process. | npj Flexible Electronics

Fig. 2: Schematic illustration and simulation of hole-opening process.

From: Evaporation-induced self-assembled ultrathin AgNW networks for highly conformable wearable electronics

Fig. 2

a Liquid film evaporation rupture under high-speed camera. b Side view of thin liquid film. c Side view of rupture of thin liquid film. d Schematic of fiber displacement. e Optical image of nanofibers displacement under surface tension. Scale bar: 25 μm. f Simulated deformation displacement of nanofibers during evaporation. Grid size: 50 μm. Deformation ratio: 1.

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