Fig. 2: Decomposition mechanism of Cuf-A2P complex analyzed using FTIR, DSC-TGA-MS and SEM.
From: Laser sintering of Cu particle-free inks for high-performance printed electronics
a Cuf-A2P complex (red) investigated for various chemical bonds present in it compared to Cuf (black) using FTIR. b DSC (black)—TGA (red) analysis of Cuf-A2P indicating various endothermic and exothermic reactions along with the mass loss taking place during the thermal decomposition of the Cu complex. c Corresponding MS of Cuf-A2P complex indicating the release of gaseous by-products during the thermal decomposition. d Synthesis of Cu-A2P complex. e Decomposition reaction mechanism of Cuf-A2P amine complex.
