Fig. 2: Architecture characterization of the sensing material. | npj Flexible Electronics

Fig. 2: Architecture characterization of the sensing material.

From: Strain-insensitive MXene-based wearable temperature patch with integrated thermoelectric cooling for continuous infant thermal monitoring and in-situ treatment

Fig. 2: Architecture characterization of the sensing material.

a Digital images of the PVA/CNF/MXene/Fe(II) composites (PCMF). b The surface morphology and c colorized cross-section SEM image with clear multi-layers architecture. d TEM and EDS images of PVA/CNF/MXene composites (PCM) and e single-layer MXene. f FTIR spectra of CNF, CNF-Fe(II). g Ti 2p and h C 1s XPS spectra of CNF/MXene and MXene composites. i Illustration of interfacial bridging based on synergistic effects between PVA, CNF, MXene, and Fe(II). j ΔR/R0 versus strain for different layers stacking. k Resistance and thickness of PCMF as functions of the compressive stress for the laminated strategy.

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