Fig. 6: Surface characterization of Cu after exposure to uninhibited and inhibited 0.01 M FeCl3 solutions. | npj Materials Degradation

Fig. 6: Surface characterization of Cu after exposure to uninhibited and inhibited 0.01 M FeCl3 solutions.

From: Corrosion inhibition of copper in ferric chloride solutions with organic inhibitors

Fig. 6

a FTIR mapping of the area shown in b after exposure to BTA-inhibited solution. Scale bar, 100 μm. cf FTIR spectra following immersion in c BTA, d MBTA, e MBI, and f Trp + CTAB solutions. g, i, k, m, o Topography and h, j, l, n, p Volta potential difference scans obtained using SKP measurements on Cu surfaces after 2-week immersion in FeCl3 solutions either uninhibited (g, h), or BTA- (i, j), MBTA- (k, l), Trp + CTAB (m, n), and MBI- (o, p) inhibited solutions. In all scans, the etched zone of the sample is on the left-hand side (lower x) while the non-etched zone is on the right-hand side. The grid lines on the color maps depict the actual tip scanning step size.

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